Author | : Riko Radojcic |
Publisher | : Springer |
Total Pages | : 182 |
Release | : 2017-02-08 |
ISBN 10 | : 9783319525488 |
ISBN 13 | : 3319525484 |
Language | : EN, FR, DE, ES & NL |
Language: en
Pages: 182
Pages: 182
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tra
Language: en
Pages: 332
Pages: 332
In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However
Language: en
Pages: 161
Pages: 161
This issue focuses on recent advances in damascene interconnects and 3D interconnects.
Language: en
Pages: 178
Pages: 178
The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-cal
Language: en
Pages: 273
Pages: 273
Language: en
Pages: 272
Pages: 272
This book provides an in-depth understanding of the various fan-out and embedded die approaches given by authors offering differing perspectives. It begins by b
Language: en
Pages: 594
Pages: 594
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe
Language: en
Pages: 232
Pages: 232
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packag
Language: en
Pages: 472
Pages: 472
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design
Language: en
Pages: 512
Pages: 512
A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for in